PEEK Sealing Plate

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PEEK Sealing Plate

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Brief Introduction:
Medical field high reliability, high-temperature sterilization withstand repeate...
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Medical field high reliability, high-temperature sterilization withstand repeated abrasion resistance and high strength requirements seepage, PEEK, PI provides the safest materials to ensure, for example, the bur sleeve, dental syringe handles, body joints, orthopedic fixation, analysis of blood through the syringe using the device reliability.

Our Processing Capacity:
1, PEEK, PAI, PI special engineering plastics and composite materials formulation design modification;
2, PEEK, PAI, PI special engineering plastics injection molding products, machining;
3, drawings according to products, 3D modeling;
4, special engineering plastics injection molding abrasive products, design, manufacture;
5, customers with special engineering plastics application development of new products and production;
6, offer free proofing service according to customer drawings or samples;
7, provide hardness, mechanical properties, friction and wear performance testing services
8, injection molding die nearly a thousand species existing aerospace industry, automotive, electronics semiconductor industry, analytical instruments industry, beverage filling machinery industry, oil and petrochemical industry, the medical device industry, etc. PEEK parts;
9, PEEK, PI, PVDF, PEI, PPS, PPSU plates, rods, tubes, sheet continuously extruded.

Below is the Data Sheet of Our PEEK Material:

	Condition	Methods	Unit	PEEK	PEEKGF30	PEEK CF30	PEEK LF30
Group				100%PEEK	PEEK+Glass fiber	PEEK+Carbon fiber	PEEK+Carbon fiber+Graphite+PTFE
mechanical properties
Density	23ºC	ISO 1183	g/cm3	1.3	1.51	1.4	1.45
friction coefficient			μ	0.35	0.4	0.28	0.18
Rockwell hardness	23ºC	ASTM D785		99	103	107	102
Shore hardness	23ºC	ISO 868		84.5		87.5	85
Water abs(3.2mm thick)	24h,23ºC	ISO 62-1	%	0.07	0.11	0.04	0.06
Water abs(3.2mm thick)	Balanced water iabsorption,23ºC			0.4		0.3
Tensile strength	Yield,23ºC	ISO 527	Mpa	100
	Crack,23ºC				180	260	140
	Crack,125ºC			50	115	160	95
	Crack,175ºC				60	85	95
	Crack,275ºC			13	35	50	35
Tensile elongation	23ºC	ISO 527	%	45	2.7	1.7	2.2
Tensile modulus	23ºC	ISO 527	Gpa	3.7	11.8	25	12.5
Bending strength	23ºC	ISO 178	Mpa	165	270	380	230
	125ºC			85	190	250
	175ºC			18	80	120
	275ºC			13	50	60
Bending modulus	23ºC	ISO 178	Gpa	4.1	11.3	23	11.5
Compressive strength	23ºC	ISO 604	Mpa	120	250	300	170
	120ºC			70	160	200	110
	200ºC				55	70
	250ºC
Charpy impact strength	Notch,23ºC	ISO 179/1eA	KJ/m2	7	8	7	5
Charpy impact strength	No notch,23ºC	ISO 179/1U		No crack	55	45	35
IZOD impact strength	Notch,23ºC	ISO 180/A	KJ/m2	7.5	10	9.5	6
IZOD impact strength	No notch,23ºC	ISO 180/U		No crack	60	45	35
Thermo properties
Melting point		ISO 3146	ºC	343	343	343	343
Glass transition temperature(Tg)	Initial temperature	ISO 3146	ºC	143	143	143	143
Thermo expansivity	Below Tg along the flow	ISO 11359	ppm/ºC	45	18	5	15
	Below Tg mean value			55	45	40	45
	Above Tg along the flow			120	18	60	20
	Above Tg mean value			140	110	100	115
Distortion temperature	1.8Mpa	ISO 75A-f	ºC	152	328	336	315
Pyroconductivity	23ºC	ASTM C177	W/mºC	0.29	0.3	0.95	0.87
Relative Thermo Index	Electrical	UL 746B	ºC	260	240
	Merchanical(non impact)			240	240		240
	Merchanical(impact)			180	240		180
Mould shrinking percentage	Along the flow	ISO 294-4	%	1	0.3	0.1	0.3
Mould shrinking percentage	vertical to flow	ISO 294-4	%	1.3	0.9	0.5	0.7
Electrical properties
Dielectrical strength	2.5mm Thickness	IEC 60243-1	KV/mm	16	20
CTI	23ºC	IEC 60112	V	150	150
loss tangent	23ºC,1MHz	IEC 60250	n/a	0.003	0.005
Dielectrical constant	23ºC,1kHz	IEC 60250	n/a	2.8	3.2
Volume resistivity	23ºC	IEC 60093	Ωcm	1016	1016	105	1010