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Home > Products > PI and PPSU > Other plastic > PEEK Dental Implants for The Medical Device Industry
Medical field high reliability, high-temperature sterilization withstand repeated abrasion resistance and high strength requirements seepage, PEEK, PI provides the safest materials to ensure, for example, the bur sleeve, dental syringe handles, body joints, orthopedic fixation, analysis of blood through the syringe using the device reliability.
Please check the data sheet of our PEEK material
| Condition | Methods | Unit | PEEK | PEEKGF30 | PEEKCF30 | PEEK LF30 | |
| Group | 100%PEEK | PEEK+Glass fiber | PEEK+Carbon fiber | PEEK+Carbon fiber+Graphite+PTFE | |||
| mechanical properties | |||||||
| Density | 23ºC | ISO 1183 | g/cm3 | 1.3 | 1.51 | 1.4 | 1.45 |
| friction coefficient | μ | 0.35 | 0.4 | 0.28 | 0.18 | ||
| Rockwell hardness | 23ºC | ASTM D785 | 99 | 103 | 107 | 102 | |
| Shore hardness | 23ºC | ISO 868 | 84.5 | 87.5 | 85 | ||
| Water abs(3.2mm thick) | 24h,23ºC | ISO 62-1 | % | 0.07 | 0.11 | 0.04 | 0.06 |
| Balanced water iabsorption,23ºC | 0.4 | 0.3 | |||||
| Tensile strength | Yield,23ºC | ISO 527 | Mpa | 100 | |||
| Crack,23ºC | 180 | 260 | 140 | ||||
| Crack,125ºC | 50 | 115 | 160 | 95 | |||
| Crack,175ºC | 60 | 85 | 95 | ||||
| Crack,275ºC | 13 | 35 | 50 | 35 | |||
| Tensile elongation | 23ºC | ISO 527 | % | 45 | 2.7 | 1.7 | 2.2 |
| Tensile modulus | 23ºC | ISO 527 | Gpa | 3.7 | 11.8 | 25 | 12.5 |
| Bending strength | 23ºC | ISO 178 | Mpa | 165 | 270 | 380 | 230 |
| 125ºC | 85 | 190 | 250 | ||||
| 175ºC | 18 | 80 | 120 | ||||
| 275ºC | 13 | 50 | 60 | ||||
| Bending modulus | 23ºC | ISO 178 | Gpa | 4.1 | 11.3 | 23 | 11.5 |
| Compressive strength | 23ºC | ISO 604 | Mpa | 120 | 250 | 300 | 170 |
| 120ºC | 70 | 160 | 200 | 110 | |||
| 200ºC | 55 | 70 | |||||
| 250ºC | |||||||
| Charpy impact strength | Notch,23ºC | ISO 179/1eA | KJ/m2 | 7 | 8 | 7 | 5 |
| No notch,23ºC | ISO 179/1U | No crack | 55 | 45 | 35 | ||
| IZOD impact strength | Notch,23ºC | ISO 180/A | KJ/m2 | 7.5 | 10 | 9.5 | 6 |
| No notch,23ºC | ISO 180/U | No crack | 60 | 45 | 35 | ||
| Thermo properties | |||||||
| Melting point | ISO 3146 | ºC | 343 | 343 | 343 | 343 | |
| Glass transition temperature(Tg) | Initial temperature | ISO 3146 | ºC | 143 | 143 | 143 | 143 |
| Thermo expansivity | Below Tg along the flow | ISO 11359 | ppm/ºC | 45 | 18 | 5 | 15 |
| Below Tg mean value | 55 | 45 | 40 | 45 | |||
| Above Tg along the flow | 120 | 18 | 60 | 20 | |||
| Above Tg mean value | 140 | 110 | 100 | 115 | |||
| Distortion temperature | 1.8Mpa | ISO 75A-f | ºC | 152 | 328 | 336 | 315 |
| Pyroconductivity | 23ºC | ASTM C177 | W/mºC | 0.29 | 0.3 | 0.95 | 0.87 |
| Relative Thermo Index | Electrical | UL 746B | ºC | 260 | 240 | ||
| Merchanical(non impact) | 240 | 240 | 240 | ||||
| Merchanical(impact) | 180 | 240 | 180 | ||||
| Mould shrinking percentage | Along the flow | ISO 294-4 | % | 1 | 0.3 | 0.1 | 0.3 |
| vertical to flow | % | 1.3 | 0.9 | 0.5 | 0.7 | ||
| Electrical properties | |||||||
| Dielectrical strength | 2.5mm Thickness | IEC 60243-1 | KV/mm | 16 | 20 | ||
| CTI | 23ºC | IEC 60112 | V | 150 | 150 | ||
| loss tangent | 23ºC,1MHz | IEC 60250 | n/a | 0.003 | 0.005 | ||
| Dielectrical constant | 23ºC,1kHz | IEC 60250 | n/a | 2.8 | 3.2 | ||
| Volume resistivity | 23ºC | IEC 60093 | Ωcm | 1016 | 1016 | 105 | 1010 |
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