PEEK grinding ring

Alternative material: PPS

As an important stage in the semiconductor manufacturing process, chemical mechanical polishing (CMP) requires strict process control, strict tolerances and high-quality surface shape and plane. The miniaturization of products and electronic devices has further raised higher requirements for process performance; all these factors have become more and more demanding, and therefore the performance requirements of the retaining ring assembly (a key component of the CMP process) have become higher and higher. The CMP retaining ring is used to fix the wafer during the polishing process. It can produce a lower polishing rate, smooth surface, strict plane tolerance, high material stability, and low vibration. However, the premise is that the material selection and design of the CMP retaining ring must be reasonable. In particular, if the bottom surface of the CMP retaining ring is very flat, the output of the wafer will also increase accordingly.

Key Benefits:

1. Higher dimensional stability; able to maintain modulus under high temperature conditions, improving process performance and product performance.

2. Easy to process;

3. Good mechanical properties; suitable for impact resistance, rapid equipment assembly, high robot speed and stable product quality.

4. Good chemical corrosion resistance; it can withstand corrosion from most chemicals, which is beneficial to protect components and extend their service life.

5. Good wear resistance.

6. It can reduce the overall system cost, and the investment has been proven to pay off.